– Driving AI & High-Performance Computing
1. Specification: HBM2e / HBM3
2. Bandwidth: > 819 GB/s (per stack)
3. Stacking: 4-12 DRAM dies
4. Bus Width: 1024-bit
5. Operating Voltage: 1.2V
6. Application Scenarios: AI training chips, high-end GPUs, HPC accelerators
